TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US

Short summary

TSMC and Amkor Technology have signed a decade-long partnership to expand advanced chip packaging and testing capabilities in Arizona. The collaboration strengthens US semiconductor supply chain resilience amid surging demand from AI and high-performance computing sectors. It represents a strategic shift toward domestic chip manufacturing capacity, reducing geopolitical supply chain vulnerabilities.

• •TSMC and Amkor sign 10-year deal to expand chip packaging in Arizona
• •Strengthens US semiconductor supply chain resilience for AI and HPC demand
• •Strategic move toward domestic US chip manufacturing self-reliance

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