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The Hindu BusinessLine Tech
The Hindu BusinessLine Tech
7/22/2026
The original headline is 10 words: "Paras Defence's semiconductor unit to set up $644-million chip packaging facility"

The original headline is 10 words: "Paras Defence's semiconductor unit to set up $644-million chip packaging facility"

Original: Paras Defence's semiconductor unit to set up $644-million chip packaging facility

Short summary

Paras Semiconductors, a unit of Paras Defence, has signed an agreement with the Madhya Pradesh government's department of science and technology to establish a $644-million outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region. The project represents a significant investment in India's growing chip packaging and testing infrastructure. No timeline or capacity details were disclosed.

  • Paras Semiconductors to build $644M OSAT facility in MP
  • Partnered with MP govt's science & technology department
  • Facility will be located in the Indore-Ujjain region

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