Besi orders more than double as AI and hybrid bonding tech drive demand

Short summary

Besi, a semiconductor packaging equipment maker, reported quarterly orders more than doubling driven by AI and hybrid bonding technology demand. The company expects 10-15% revenue growth as data center AI applications fuel adoption of advanced chip packaging. This mirrors broader strength across the semiconductor sector.

• •Besi quarterly orders more than double on AI demand
• •Hybrid bonding and advanced packaging driving growth
• •Revenue guidance of 10-15% growth

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